Aethercomm, Alcatel-Lucent, Ampleon, Anadigics, AT&T, Bell Laboratory, Cisco, China Mobile, China Telecom, China Unicom, Cree, Dynax, Dowa, EADS, Epigan, Ericsson, Eudyna, Freiburg/Univ. Ulm/FraunhoferIAF, Filtronic, Freescale, Fujitsu, Global communication semiconductors, Hittite/Keragis, Huawei, II-VI Inc, IMEC, IMECAS Infineon, Intel, IQE, KDDI, KT, LG Plus, Lockheed Martin, M/A-COM, Microsemi, Mitsubishi Chemical, Mitsubishi Electric, Motorola, NEC, Nitronex, Norstel, Nokia Networks, Northrop Grumman, NTT, NTT DOCOMO, NXP, OMMIC, Powdec, Qorvo, Qualcomm, RFHIC, RF Lambda, RFMD, Samsung, SICC, SiCrystal, SK Telecom, Softbank, Sprint, STMicroelectronics, Sumitomo Electric, Enkris Semiconductor, Raytheon, TankeBlue, Telstra, Thales, Thales III-V Lab, T-Mobile, Toshiba, Triquint, UMS, Unity Wireless, Verizon, Vodafone, WIN Semiconductors, Wolfspeed, and ZTE
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